Discrete devices: Fabrication and processing techniques, borrowed from LSI technology, play major roles in new component designs

Describes how materials processing and fabrication techniques, have made possible the production of denser, smaller, and faster components during the past year. Among the components were high-frequency power-switching devices, microwave devices for communications, solid-state relays, and isolation amplifier transformers. Solid-state devices can now handle over 10 million watts. In the laboratory GaAs FETs have moved to even higher frequencies and even lower noise figures. The state of the art is an 8-gigahertz FET fabricated with electron-beam lithography with a 1.1-decibel noise figure and 14-dB associated gain.