DocumentCode
1345992
Title
Advanced thermal analysis of packaged electronic systems using computational fluid dynamics techniques
Author
Reynell, Michael
Author_Institution
Flomerics, Kingston-upon-Thames, UK
Volume
7
Issue
4
fYear
1990
fDate
8/1/1990 12:00:00 AM
Firstpage
104
Lastpage
106
Abstract
Most electronic system failures are due to thermal overstressing, and the major current trends in electronics design are adding to the thermal problem. This article introduces a new class of electronics thermal analysis tool, which uses computational fluid dynamics (CFD) techniques to predict the three-dimensional air movement and associated heat-transfer processes in electronics enclosures
Keywords
fluid dynamics; heat transfer; packaging; thermal analysis; computational fluid dynamics; electronic system failures; electronics design; electronics enclosures; heat-transfer processes; packaged electronic systems; thermal analysis; three-dimensional air movement;
fLanguage
English
Journal_Title
Computer-Aided Engineering Journal
Publisher
iet
ISSN
0263-9327
Type
jour
Filename
60402
Link To Document