Title :
2 Gbit/s small form factor fiber-optic transceiver for single mode optical fiber
Author :
Sunaga, Yoshinori ; Takahashi, Ryuta ; Tokoro, Takehiko ; Kobayashi, Masahiko
Author_Institution :
Optoelectron. Syst. Lab., Hitachi Cable Ltd., Ibaraki, Japan
fDate :
5/1/2000 12:00:00 AM
Abstract :
Small form factor (SFF) optical transceivers are expected to be commonly used in the near future for high-end (high bit-rate, single mode) applications as well as for low-cost applications. SFF optical transceivers require new packaging techniques for the optical portion, because the distance between input and output optical axes is much smaller than those of conventional transceivers, e.g., the “1by9” type. Two types of optical packaging are introduced, both of which are suitable for transceivers which have an MT-based receptacle for single mode applications. One of the packaging types, a fiber-bulk structure, takes full advantage in cost and reliability of standard, hermetically sealed TO-canned optical devices. A conventional TO-can packaged laser diode (LD) and photodiode (PD) are held with short optical fibers by low-cost, injection-molded polymer retainers. The short fibers are connected to an MT ferrule inside the transceiver. An alternative packaging type, a surface mount structure, is intended for drastic cost reduction in large volume production by using advanced highly integrated assembly. An LD chip with an integrated spot-size converter and a waveguide-structured PD chip are mounted on a Si-substrate. Optical coupling between the optical devices and fibers on V-groove is accomplished by passive alignment, which reduces assembling time. A prototype transceiver with an MPO receptacle has been developed using the former packaging structure. Evaluated results show performance which complies with the 2.125 Gbit/s Fiber Channel standard. SFF transceivers with these new packaging technologies are expected to increase the optical port density and also to reduce the cost of high-end systems with bit rate of 2 Gbit/s or higher per port
Keywords :
integrated optoelectronics; optical fibre networks; optical receivers; optical transmitters; plastic packaging; surface mount technology; transceivers; 2 Gbit/s; TO-can packaged laser diode; advanced highly integrated assembly; cost reduction; ferrule; fiber-bulk structure; fiber-optic transceiver; injection-molded polymer retainers; large volume production; optical connector; optical packaging; optical port density; optical transceivers; passive alignment; photodiode; single mode optical fiber; small form factor; surface mount structure; Assembly; Costs; Diode lasers; Hermetic seals; Optical devices; Optical fiber devices; Optical fibers; Optical waveguides; Packaging; Transceivers;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/6040.846630