Title :
Agilent technologies´ singlemode small form factor (SFF) module incorporates micromachined silicon, automated passive alignment, and non-hermetic packaging to enable the next generation of low-cost fiber optic transceivers
Author_Institution :
Fiber Components Div., Agilent Technol., Suffolk, UK
fDate :
5/1/2000 12:00:00 AM
Abstract :
Agilent Technologies (formerly Hewlett-Packard) are currently manufacturing a range of multimode and singlemode (SM) SFF transceivers with data rates from 125 Mb/s to 1.25 Gb/s (higher data rates are being developed). This paper will address the singlemode module design, assembly techniques and performance. The SFF transceivers offer the same functionality as SC duplex transceivers but utilize the mini MT-RJ optical interface in order to achieve twice the port density. Test results that demonstrate the performance of the mini MT-RJ optical interface will be presented. The SFF modules are price competitive with SC duplex modules, and are designed to enable low cost, high volume manufacture. In order to meet the size constraints and achieve low manufacturing costs, the SM SFF transceiver utilizes silicon as a base to support the optical fibers and active components, and as an aid to passively align of the active components to the fibers. Most other passively aligned modules require the use of a more expensive expanded mode region laser diode (LD). But Agilent Technologies have developed a unique passive align and attach system that can easily achieve the required coupling power for fast ethernet, OC3 and gigabit ethernet using a standard 1300 mn Strained Multiquantum Well (SMQW) LD. The module design and the methods used for passive align will be discussed, as will the precision die attach (PDA) equipment. All precious Agilent Technologies/Hewlett-Packard SM modules relied on an Hermetic cavity around the active devices to achieve the reliability assurance, e.g., as defined in Bellcore TA-NWT-000983, but this type of Hermetic design has limited potential for cost reduction. The SM SFF module is designed to meet the same assurance levels, but uses silicone encapsulation in place of Hermeticity, and the results of the qualification testing will be presented
Keywords :
encapsulation; laser reliability; microassembling; modules; optical receivers; optical transmitters; plastic packaging; semiconductor device packaging; semiconductor device reliability; transceivers; assembly techniques; automated passive alignment; low manufacturing cost; low-cost fiber optic transceivers; micromachined silicon; mini MT-RJ optical interface; next generation transceivers; non-hermetic packaging; plastic housing; precision die attach; qualification testing; receiver subassembly; reliability; silicon optical bench; silicone encapsulation; single-mode small form factor module; size constraints; strained MQW LD; transmitter subassembly; Assembly; Costs; Ethernet networks; Manufacturing; Optical fiber devices; Optical fibers; Samarium; Silicon; Testing; Transceivers;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/6040.846631