مرکز منطقه ای اطلاع رساني علوم و فناوري - Foreword contributions from TC- 18 wafer scale packaging [Guest Editor]

DocumentCode :

1346059

Title :

Foreword contributions from TC- 18 wafer scale packaging [Guest Editor]

Author :

Garrou, P.

Author_Institution :

Dow Chemicals

Volume :

Issue :

fYear :

2000

fDate :

5/1/2000 12:00:00 AM

Firstpage :

197

Lastpage :

197

Keywords :

Chemical technology; Chemistry; Components, Packaging, and Manufacturing Technology Society; Costs; Electronic components; Electronics packaging; Paper technology; Semiconductor device packaging; Testing; Wafer scale integration;

fLanguage :

English

Journal_Title :

Advanced Packaging, IEEE Transactions on

Publisher :

ieee

ISSN :

1521-3323

Type :

jour

DOI :

10.1109/TADVP.2000.846633

Filename :

846633

Link To Document :

https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1346059