• DocumentCode
    1346059
  • Title

    Foreword contributions from TC- 18 wafer scale packaging [Guest Editor]

  • Author

    Garrou, P.

  • Author_Institution
    Dow Chemicals
  • Volume
    23
  • Issue
    2
  • fYear
    2000
  • fDate
    5/1/2000 12:00:00 AM
  • Firstpage
    197
  • Lastpage
    197
  • Keywords
    Chemical technology; Chemistry; Components, Packaging, and Manufacturing Technology Society; Costs; Electronic components; Electronics packaging; Paper technology; Semiconductor device packaging; Testing; Wafer scale integration;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2000.846633
  • Filename
    846633
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1346059