DocumentCode
1346165
Title
Factors influencing the permittivity of polymer/ceramic composites for embedded capacitors
Author
Ogitani, Satoshi ; Bidstrup-Allen, Sue Ann ; Kohl, Paul A.
Author_Institution
Electron. Mater. & Devices Lab., Asahi Chem. Ind. Co. Ltd., Fuji-shi, Japan
Volume
23
Issue
2
fYear
2000
fDate
5/1/2000 12:00:00 AM
Firstpage
313
Lastpage
322
Abstract
The effect of the polymer permittivity on the permittivity of the polymer/lead magnesium niobate-lead titanate (PMN-PT) composite was investigated using epoxies, polyimides, polycarboxylic acids, and poly(methyl methacrylate) (PMMA). The permittivity of the polymers (without ceramic loading) ranged from 2.8-4.6. The permittivity of the composites, except for epoxies, was found to agree with the value predicted by the Smith equation. Polyacrylic acid (PAA) was found to bond to the PMN-PT surface due to an acid-base reaction. Novolac epoxy was not found to interact strongly with PMN-PT. The results suggest that polycarboxylic acids can act as a surfactant to deagglomerate PMN-PT powder while epoxies might not. Hence, the lower permittivity found in the epoxy based composites may be due to particle agglomeration. Three out of eight phosphated ester type surfactants were shown to increase the composite permittivity, indicating that the most effective surfactants decreased agglomeration of the ceramic powder and improved the dispersion in the polymer matrix. The particle size of the PMN-PT in the same solvent as used in the composite experiment was reduced by the use of ball-milling with the aid of the surfactant. Assuming that agglomerated particles act as a larger particle, an electrostatic field simulation was used to determine that the reduction in particle size due to deagglomeration increased the permittivity of the composite. These results were confirmed by experiment
Keywords
capacitors; ferroelectric ceramics; filled polymers; lead compounds; magnesium compounds; niobium compounds; packaging; particle reinforced composites; particle size; permittivity; surfactants; PMMA; PMN-PbTiO3; PbMgO3NbO3-PbTiO3; acid-base reaction; ball-milling; dispersion; electrostatic field simulation; embedded capacitors; epoxies; particle agglomeration; particle size; permittivity; phosphated ester type surfactants; polyacrylic acid; polycarboxylic acids; polyimides; polymer/ceramic composites; Bonding; Ceramics; Dispersion; Equations; Magnesium; Permittivity; Polyimides; Polymers; Powders; Titanium compounds;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/6040.846650
Filename
846650
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