DocumentCode :
1346812
Title :
Polymeric arc chamber walls influence on AgW/AgC contact resistance
Author :
Shea, John J.
Author_Institution :
Cutler-Hammer Inc., Pitsburgh, PA, USA
Volume :
23
Issue :
2
fYear :
2000
fDate :
6/1/2000 12:00:00 AM
Firstpage :
205
Lastpage :
210
Abstract :
Contact resistance was measured after arcing for AgW moving against an AgC stationary contact pair in an arc chamber, Contact resistance, measured at five different current levels over the range of 2 kAp to 22 kAp, was compared using two different arc chamber wall materials, ceramic and polyester, to determine if gases evolved from the polyester during arcing produced contaminants on the contact surface causing a resistance increase. When compared to results using ceramic walls, polyester walls did not show any statistical difference in contact resistance. However, increased chamber pressure, resulting from ablation of the polyester walls, was measured; scanning electron microscope (SEM) photographs and energy dispersive spectroscopy (EDS) surface mapping measurements showed the change in resistance, for both wall materials, was due to a depletion of silver from the contact surface at mid-range arcing currents and redeposition of silver at higher arcing currents. Discussions include the effect of arc temperature on contact resistance and the various gases, generated by the ablation of the polymer walls, on resistance and arc chamber pressure
Keywords :
X-ray chemical analysis; circuit breakers; circuit-breaking arcs; contact resistance; scanning electron microscopy; silver alloys; AgW-AgC; ablation; arc temperature; contact resistance; contact surface; energy dispersive spectroscopy; mid-range arcing currents; polymeric arc chamber walls; scanning electron microscope; stationary contact pair; surface mapping measurements; Ceramics; Contact resistance; Current measurement; Electrical resistance measurement; Energy measurement; Gases; Pollution measurement; Polymers; Surface contamination; Surface resistance;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/6144.846755
Filename :
846755
Link To Document :
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