DocumentCode :
1346929
Title :
Finite-element electromagnetic characterization of parasitics in multifinger thermally shunted HBTs
Author :
Dhondt, F. ; Barrette, J. ; Haese, N. ; Rolland, P.A. ; Delage, S.L.
Author_Institution :
Inst. d´´Electron. et de Microelectron. du Nord, Villeneuve d´´Ascq, France
Volume :
8
Issue :
4
fYear :
1998
fDate :
4/1/1998 12:00:00 AM
Firstpage :
167
Lastpage :
169
Abstract :
This work describes a methodology to extract parasitic capacitances and evaluate losses in multifinger thermally shunted heterojunction bipolar transistors (HBTs) using three dimensional (3-D) electromagnetic modeling. This method is based on the partitioning of the structure into zones of propagation, which simplifies the analysis of the computed scattering matrices. The approach is validated using on-wafer measurements of open-circuit test structures. This work also addresses the impact of changes in device topology on parasitic coupling capacitance and association efficiency
Keywords :
S-matrix theory; capacitance; finite element analysis; heterojunction bipolar transistors; losses; microwave bipolar transistors; semiconductor device models; 3D electromagnetic modeling; association efficiency; device topology; finite-element EM characterization; heterojunction bipolar transistors; losses; multifinger thermally shunted HBTs; parasitic capacitances extraction; parasitic coupling capacitance; parasitics; propagation zones; scattering matrices; three dimensional EM modeling; Circuit simulation; Coupling circuits; DH-HEMTs; Electromagnetic coupling; Electromagnetic modeling; Electromagnetic propagation; Finite element methods; Heterojunction bipolar transistors; Metallization; Parasitic capacitance;
fLanguage :
English
Journal_Title :
Microwave and Guided Wave Letters, IEEE
Publisher :
ieee
ISSN :
1051-8207
Type :
jour
DOI :
10.1109/75.663522
Filename :
663522
Link To Document :
بازگشت