Title :
Substrate crosstalk suppression capability of silicon-on-insulator substrates with buried ground planes (GPSOI)
Author :
Hamel, J.S. ; Stefanou, S. ; Bain, M. ; Armstrong, B.M. ; Gamble, H.S.
Author_Institution :
Dept. of Electron. & Comput. Sci., Southampton Univ., UK
fDate :
4/1/2000 12:00:00 AM
Abstract :
Experimental s/sub 21/ transmission crosstalk studies have been conducted on silicon-on-insulator substrates with buried ground planes (GPSOI´s) where a 2 /spl Omega/ per square metal-silicide buried ground plane existed between a 15 /spl Omega/-cm p-type silicon substrate and a 1 μm thick buried CVD oxide layer. Locally grounded transmission test structures fabricated on GPSOI were found to exhibit 20 dB increased crosstalk suppression compared to published data for high resistivity (200 /spl Omega/-cm) SOI substrates incorporating capacitive guard rings over a frequency range from 500 MHz to 50 GHz. This represents an order of magnitude improvement in crosstalk power suppression capability compared to existing state-of-the-art suppression techniques in silicon substrates.
Keywords :
MIMIC; MMIC; UHF integrated circuits; buried layers; crosstalk; earthing; interference suppression; silicon-on-insulator; substrates; 500 MHz to 50 GHz; MIMIC substrate; MMIC substrate; RFIC substrate; SOI substrates; Si; buried CVD oxide layer; buried ground planes; locally grounded transmission test structures; metal-silicide ground plane; p-type Si substrate; s/sub 21/ transmission crosstalk; substrate crosstalk suppression capability; Conductivity; Crosstalk; Isolation technology; Manufacturing; Metallization; Microwave frequencies; Programmable logic arrays; Silicides; Silicon on insulator technology; Wafer bonding;
Journal_Title :
Microwave and Guided Wave Letters, IEEE