Design of a Reverse-Connected Module for Nanostructure Removal From Display Color Filters

This paper proposes a new design module for reverse-connected microelectrochemical machining (μ-ECM), which is based on a novel electrochemical reaction that offers the fast removal of indium-tin-oxide (ITO) nanostructures from the surfaces of color filters in displays. Unlike general μ-ECM models, the reverse-connected μ-ECM model is implemented by connecting a workpiece to the cathode and an electrode to the anode of a dc power supply. During the course of machining, electrons travel from the cathode to the anode, so that the ITO film is lifted and removed at high speed by an electric field. In general μ-ECM models, a workpiece is connected to the anode, an electrode is connected to the cathode, and the material removal is achieved by dissolution. In contrast, the reverse-connected μ-ECM model provides higher removal efficiency and higher surface quality of color filters in displays during machining processes, thereby breaking new ground in superfine machining for applications in the photoelectric semiconductor industry.