DocumentCode :
1347896
Title :
An experimental thermal siphon bushing
Author :
Zeng, Daxiong
Author_Institution :
Lapp Insulator Co., LeRoy, NY, USA
Volume :
15
Issue :
1
fYear :
2000
fDate :
1/1/2000 12:00:00 AM
Firstpage :
175
Lastpage :
177
Abstract :
An experimental thermal siphon bushing was constructed and tested. The thermal siphon was made from the hollow conductor of a paper-resin bushing with water as heat transport fluid. The test shows that this bushing has almost uniform temperature distribution under its critical current and the temperature of its hottest spot is close to the boiling temperature of water. The current carrying capacity of this thermal siphon bushing is 50% more than that of the same bushing without thermal siphon. Simple formulas are proposed to determine the critical current of a thermal siphon bushing and estimate the temperature of the hottest spot if the bushing with thermal siphon is operated above the nameplate rating
Keywords :
bushings; condensation; conductors (electric); cooling; evaporation; paper; polymers; temperature distribution; 1200 A; 350 kV; condensation; critical current; current carrying capacity; evaporation; heat transport fluid; hollow conductor; hottest spot temperature; paper-resin bushing; thermal siphon bushing; uniform temperature distribution; water; Conductors; Cooling; Copper; Critical current; Insulators; Petroleum; Temperature distribution; Testing; Thermal conductivity; Water heating;
fLanguage :
English
Journal_Title :
Power Delivery, IEEE Transactions on
Publisher :
ieee
ISSN :
0885-8977
Type :
jour
DOI :
10.1109/61.847247
Filename :
847247
Link To Document :
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