Title :
Flip-chip solder bond mounting of laser diodes
Author :
Edge, C. ; Ash, R.M. ; Jones, C.G. ; Goodwin, M.J.
Author_Institution :
Plessey Res. Caswell Ltd., Towcester, UK
fDate :
3/14/1991 12:00:00 AM
Abstract :
The successful hybrid mounting of semiconductor laser diode chips by flip-chip solder bonding is reported. This technique allows accurate chip placement with submicron positioning, and has demonstrated acceptable heat dissipation characteristics.
Keywords :
flip-chip devices; semiconductor junction lasers; soldering; Si mother board; accurate chip placement; flip-chip solder bonding; heat dissipation characteristics; hybrid mounting; laser diode bond mounting; semiconductor laser diode chips; submicron positioning;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19910314
