Title :
Thermal Design of Electronic-Circuit Layout For Reliability
Author :
Gupta, Hariom ; Sharma, Jaydev
Author_Institution :
Department of Electrical Engineering; University of Roorkee; Roorkee, 247672 INDIA.
fDate :
4/1/1982 12:00:00 AM
Abstract :
A method for laying out electronic components on back board, which minimizes the maximum temperature rise of components is presented. This avoids hot spots on the board. Sensitivity analysis is adopted for optimal placement of components on the circuit board and certain relations are derived with a view to reduce the computational effort of sensitivity analysis.
Keywords :
Electronic components; Electronic packaging thermal management; Heat sinks; Power dissipation; Printed circuits; Sensitivity analysis; Temperature distribution; Temperature sensors; Thermal engineering; Thermal resistance; Layout; Thermal coupling; Thermal resistance;
Journal_Title :
Reliability, IEEE Transactions on
DOI :
10.1109/TR.1982.5221214
