DocumentCode :
1348406
Title :
Interrelationship of voltage and temperature dependence of oxide breakdown for ultrathin oxides
Author :
Wu, Ernest Y. ; Harmon, David L. ; Han, Liang-Kai
Author_Institution :
Microelectron. Div., IBM Corp., Essex Junction, VT, USA
Volume :
21
Issue :
7
fYear :
2000
fDate :
7/1/2000 12:00:00 AM
Firstpage :
362
Lastpage :
364
Abstract :
We report that voltage acceleration of time- or charge-to-breakdown is insensitive to temperature variations over a wide range of temperature (30 to 200/spl deg/C) for oxides below 3 nm, regardless of oxide process, injection polarity or device type (NFET, PFET). Based on this observation, an essentially universal, non-Arrhenius temperature dependence for ultrathin oxide is obtained by a natural normalization scheme. The consequences of these findings for reliability projection are discussed.
Keywords :
MOS capacitors; MOSFET; dielectric thin films; electric potential; semiconductor device breakdown; semiconductor device reliability; 3 nm; 30 to 200 C; charge-to-breakdown; gate dielectric; natural normalization scheme; nonArrhenius temperature dependence; oxide breakdown; reliability projection; temperature variations; time-to-breakdown; ultrathin oxides; voltage acceleration; voltage dependence; Acceleration; Breakdown voltage; Capacitors; Databases; Dielectrics; Electric breakdown; Quantum mechanics; Substrates; Temperature dependence; Temperature distribution;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.847381
Filename :
847381
Link To Document :
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