DocumentCode :
134848
Title :
About the symposium
fYear :
2014
fDate :
Feb. 28 2014-March 2 2014
Firstpage :
1
Lastpage :
1
Abstract :
IEEE Students´ Technology Symposium is an annual event conceptualized by IEEE Kharagpur Section and Student Branch, IIT Kharagpur. 2014 IEEE Students´ Technology Symposium (IEEE TechSym 2014) is the third version of this event and is being held at the lush green and youthful campus of IIT Kharagpur, India. Conceptualized as an event for nurturing the talent of students?? and young professionals, it has matured to a prominently visible and cited podioum for students and young professionals. The symposium had received a total of 410 submissions till the extended deadline which closed on 14 Nov. 2013 submitted to 8 regular tracks. A total of 35 Area Chairs along with 818 Reviewers worldwide participated in the review process during 14 Nov. 2013 - 28 Dec. 2013. Each of the papers were reviewed by the Area Chairs and forwarded to Reviewers if found compliant with Editorial Policies. The Area Chairs prepared consolidated reports for each of the papers assigned to them based on the comments of the Reviewers and using their own judgment of the work. The final decision to Accept or Reject was taken at a meeting of the Technical Program Committee in consultation with the Advisory Committee held at IIT Kharagpur during 14-28 Dec. 2013. Some of the papers were discussed at length and at depth before the final decision was arrived at. The double blinded review process was rigorous and without quotas or expectations on the numbers of papers. Finally 40 papers were selected for Oral presentation with acceptance rate of 9.7% and 56 papers were selected for Poster session with acceptance rate of 23.4%. We had also received 14 Late Breaking Research papers of which 6 were accepted for presentation.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Students' Technology Symposium (TechSym), 2014 IEEE
Conference_Location :
Kharagpur, West Bengal, India
Print_ISBN :
978-1-4799-2607-7
Type :
conf
DOI :
10.1109/TechSym.2014.6807898
Filename :
6807898
Link To Document :
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