• DocumentCode
    1348803
  • Title

    Electrical Characterization of Screen-Printed Circuits on the Fabric

  • Author

    Kim, Yongsang ; Kim, Hyejung ; Yoo, Hoi-Jun

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., KAIST, Daejeon, South Korea
  • Volume
    33
  • Issue
    1
  • fYear
    2010
  • Firstpage
    196
  • Lastpage
    205
  • Abstract
    Fabrication methods of planar printed circuits on fabrics are introduced and their electrical characteristics are measured and analyzed. Wet patterning method like screen printing as well as dry process of sputtering are used to fabricate the patterned film electrodes on various types of fabrics. The minimum width of the patterns is 0.2 mm for screen printing and 0.1 mm for gold sputtering, and the typical sheet resistance is 134 m ??/??. Fabrication methods of capacitors of 1 pF-1 nF and inductors of 500 nH-1 ??H at 10 MHz on the fabrics are also introduced. Bonding and packaging of silicon chip directly on the fabric circuit board are proposed and their mechanical properties are investigated. The ac impedance of the transmission line is measured as 201-215 ?? with variation, and the time-domain reflectometry profile shows that the -3 dB frequency of the printed transmission line of 15 cm on the fabric is 80 MHz. A complete system composed of a fabric capacitor sensor input, a controller system-on-a-chip, and an LED array display is implemented on the fabric and its operation is demonstrated successfully.
  • Keywords
    LED displays; bonding processes; capacitive sensors; capacitors; electronics packaging; flexible electronics; inductors; printed circuit manufacture; sputtering; system-on-chip; thick film circuits; LED array display; bonding; capacitance 1 pF to 1 nF; dry process; electrical characterization; fabric capacitor sensor; fabrication methods; fabrics; film electrodes; gold sputtering; inductors; mechanical properties; packaging; planar printed circuits; planar-fashionable circuit board; screen printing; screen-printed circuits; sheet resistance; system-on-a-chip; thick film process; time-domain reflectometry profile; transmission line impedance; wet patterning method; E-textile; electrical characterization of fabric; fabric; packaging; planar-fashionable circuit board (P-FCB); silk-screen printing; sputtering; transmission lines; wearable computing;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2009.2034536
  • Filename
    5345718