DocumentCode
1349664
Title
An analytical delay model for RLC interconnects
Author
Kahng, Andrew B. ; Muddu, Sudhakar
Author_Institution
Dept. of Comput. Sci., California Univ., Los Angeles, CA, USA
Volume
16
Issue
12
fYear
1997
fDate
12/1/1997 12:00:00 AM
Firstpage
1507
Lastpage
1514
Abstract
Elmore delay has been widely used to estimate interconnect delays in the performance-driven synthesis and layout of very-large-scale-integration (VLSI) routing topologies. For typical RLC interconnections, however, Elmore delay can deviate significantly from SPICE-computed delay, since it is independent of inductance of the interconnect and rise time of the input signal. Here, we develop an analytical delay model based on first and second moments to incorporate inductance effects into the delay estimate for interconnection lines under step input. Delay estimates using our analytical model are within 15% of SPICE-computed delay across a wide range of interconnect parameter values. We also extend our delay model for estimation of source-sink delays in arbitrary interconnect trees. We observe significant improvement in the accuracy of delay estimates for interconnect trees when compared to the Elmore model, yet our estimates are as easy to compute as Elmore delay. Evaluation of our analytical models is several orders of magnitude faster than simulation using SPICE. We also illustrate the application of our model in controlling response undershoot/overshoot and reducing interconnect delay through constraints on the moments
Keywords
VLSI; circuit layout CAD; delays; inductance; integrated circuit interconnections; integrated circuit layout; integrated circuit modelling; network routing; trees (mathematics); RLC interconnects; VLSI; analytical delay model; arbitrary interconnect trees; inductance effects; interconnect parameter values; interconnection lines; performance-driven layout; response undershoot/overshoot; routing topologies; source-sink delays; Analytical models; Computational modeling; Delay effects; Delay estimation; Inductance; Routing; SPICE; Signal synthesis; Topology; Very large scale integration;
fLanguage
English
Journal_Title
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher
ieee
ISSN
0278-0070
Type
jour
DOI
10.1109/43.664231
Filename
664231
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