DocumentCode :
1350652
Title :
Use of transient enhanced diffusion to tailor boron out-diffusion
Author :
Vuong, Hong-Ha ; Xie, Ya-Hong ; Frei, Michael R. ; Hobler, Gerhard ; Pelaz, Lourdes ; Rafferty, Conor S.
Author_Institution :
Lucent Technol. Bell Labs., Murray Hill, NJ, USA
Volume :
47
Issue :
7
fYear :
2000
fDate :
7/1/2000 12:00:00 AM
Firstpage :
1401
Lastpage :
1405
Abstract :
We report experimental results demonstrating the use of transient enhanced diffusion (TED) caused by silicon implant for “tuning” boron out-diffusion. The effect was measured as a function of the silicon implant dose and anneal temperature, and a range of boron junction depth movement from almost none up to 81 nm was observed with increasing TED at 750°C. The diffused profiles could be approximated by using a modified solubility limit model to describe the enhanced boron diffusion and clustering. However, by using a more sophisticated continuum model based on atomistic calculations, excellent agreement with the measured profiles could he obtained. In addition, the fit to the measured data yields the fraction of boron present in BI2 precursor clusters after silicon implant as a function of the silicon implant dose. Two possible applications of the TED “tuning” are discussed, with device simulations which show that the effect is sufficiently large to tune the base width of a bipolar device from being depleted to that suitable for a high performance device
Keywords :
annealing; boron; diffusion; doping profiles; elemental semiconductors; ion implantation; silicon; 750 C; Si:B; annealing; bipolar device; boron out-diffusion; clustering; continuum model; doping profile; numerical simulation; silicon implantation; solubility; transient enhanced diffusion; Atomic measurements; Bismuth; Boron; Circuit simulation; Diffusion processes; Implants; Ion implantation; Rapid thermal annealing; Silicon; Temperature distribution;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.848283
Filename :
848283
Link To Document :
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