• DocumentCode
    1350652
  • Title

    Use of transient enhanced diffusion to tailor boron out-diffusion

  • Author

    Vuong, Hong-Ha ; Xie, Ya-Hong ; Frei, Michael R. ; Hobler, Gerhard ; Pelaz, Lourdes ; Rafferty, Conor S.

  • Author_Institution
    Lucent Technol. Bell Labs., Murray Hill, NJ, USA
  • Volume
    47
  • Issue
    7
  • fYear
    2000
  • fDate
    7/1/2000 12:00:00 AM
  • Firstpage
    1401
  • Lastpage
    1405
  • Abstract
    We report experimental results demonstrating the use of transient enhanced diffusion (TED) caused by silicon implant for “tuning” boron out-diffusion. The effect was measured as a function of the silicon implant dose and anneal temperature, and a range of boron junction depth movement from almost none up to 81 nm was observed with increasing TED at 750°C. The diffused profiles could be approximated by using a modified solubility limit model to describe the enhanced boron diffusion and clustering. However, by using a more sophisticated continuum model based on atomistic calculations, excellent agreement with the measured profiles could he obtained. In addition, the fit to the measured data yields the fraction of boron present in BI2 precursor clusters after silicon implant as a function of the silicon implant dose. Two possible applications of the TED “tuning” are discussed, with device simulations which show that the effect is sufficiently large to tune the base width of a bipolar device from being depleted to that suitable for a high performance device
  • Keywords
    annealing; boron; diffusion; doping profiles; elemental semiconductors; ion implantation; silicon; 750 C; Si:B; annealing; bipolar device; boron out-diffusion; clustering; continuum model; doping profile; numerical simulation; silicon implantation; solubility; transient enhanced diffusion; Atomic measurements; Bismuth; Boron; Circuit simulation; Diffusion processes; Implants; Ion implantation; Rapid thermal annealing; Silicon; Temperature distribution;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.848283
  • Filename
    848283