DocumentCode
1352256
Title
Support vector machine-based inspection of solder joints using circular illumination
Author
Yun, T.S. ; Sim, K.J. ; Kim, H.J.
Author_Institution
Dept. of Comput. Eng., Kyungpook Nat. Univ., Taegu, South Korea
Volume
36
Issue
11
fYear
2000
fDate
5/25/2000 12:00:00 AM
Firstpage
949
Lastpage
951
Abstract
A method for inspecting solder joints using support vector machines (SVMs) and a tiered circular illumination technique is proposed. The illumination technique provides visual information that allows the 3D shape of the solder joint surface to be determined. The extracted features are used to classify the solder joint using an SVM classifier. Experimental results show the effectiveness of the proposed method.
Keywords
automatic optical inspection; 3D shape; AOI; SVM classifier; extracted features; solder joint inspection; solder joint surface; support vector machine-based inspection; tiered circular illumination technique;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:20000342
Filename
848982
Link To Document