Abstract :
Smaller than the traditional dual in-line package (DIP), the quad in-line package (QUIP) allows a much larger, higher density, faster device to be packaged. The manufacturer says that the 64-pin QUIP is also superior to the 40-pin DIPS generally used to package microprocessrs and to the 68-pin square package. The new package can be used efficiently on both low-cost, two-sided wiring boards and on multilayer boards.
