Title :
Numerical Assessment of Radiated Susceptibility of Twisted-Wire Pairs With Random Nonuniform Twisting
Author :
Spadacini, Giordano ; Pignari, Sergio A.
Author_Institution :
Dept. of Electr. Eng., Politec. di Milano, Milan, Italy
Abstract :
The influence of twist-pitch nonuniformity on the radiated susceptibility of a twisted-wire pair (TWP) running above ground and illuminated by a plane-wave field is investigated via a transmission-line model. The geometrical representation of the TWP involves a bifilar helix with a variable pitch function, which readily allows for the description of any unwanted/unknown deviations from the ideal twist geometry. Basic examples are used to show that such a deformation plays a fundamental role in the pickup of differential-mode (DM) noise, thus substantiating the need for the proposed prediction model. By describing the pitch random variations as a spatial stochastic process, a realistic representation of the twisting features is obtained (both for TWPs with imperfect uniform twists and for TWPs intentionally manufactured with random nonuniform twists). Repeated runs are used to characterize the sensitivity of the induced DM noise to random nonuniform twisting. Especially, it is shown that the twist-pitch nonuniformity, sometimes intentionally used to reduce pair-to-pair crosstalk in TWP cables, may however lead to a severe decrease of the TWP immunity to external fields.
Keywords :
crosstalk; stochastic processes; transmission line theory; twisted pair cables; TWP cables; bifilar helix; differential mode noise; numerical assessment; pair-to-pair crosstalk; plane-wave field; prediction model; radiated susceptibility; random nonuniform twisting; spatial stochastic process; transmission line model; twist-pitch nonuniformity; twisted-wire pairs; variable pitch function; Couplings; Moment methods; Noise; Predictive models; Sensitivity; Vectors; Wires; Field-to-wire coupling; statistical EMC models; transmission-line (TL) model; twisted-wire pairs (TWPs);
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
DOI :
10.1109/TEMC.2012.2235446