• DocumentCode
    1353726
  • Title

    Design of Last-Level On-Chip Cache Using Spin-Torque Transfer RAM (STT RAM)

  • Author

    Xu, Wei ; Sun, Hongbin ; Wang, Xiaobin ; Chen, Yiran ; Zhang, Tong

  • Author_Institution
    Electr. & Comput. Sci. Engi neering (ECSE) Dept., Rensselaer Polytech. Inst., Troy, NY, USA
  • Volume
    19
  • Issue
    3
  • fYear
    2011
  • fDate
    3/1/2011 12:00:00 AM
  • Firstpage
    483
  • Lastpage
    493
  • Abstract
    Because of its high storage density with superior scalability, low integration cost and reasonably high access speed, spin-torque transfer random access memory (STT RAM) appears to have a promising potential to replace SRAM as last-level on-chip cache (e.g., L2 or L3 cache) for microprocessors. Due to unique operational characteristics of its storage device magnetic tunneling junction (MTJ), STT RAM is inherently subject to a write latency versus read latency tradeoff that is determined by the memory cell size. This paper first quantitatively studies how different memory cell sizing may impact the overall computing system performance, and shows that different computing workloads may have conflicting expectations on memory cell sizing. Leveraging MTJ device switching characteristics, we further propose an STT RAM architecture design method that can make STT RAM cache with relatively small memory cell size perform well over a wide spectrum of computing benchmarks. This has been well demonstrated using CACTI-based memory modeling and computing system performance simulations using SimpleScalar. Moreover, we show that this design method can also reduce STT RAM cache energy consumption by up to 30% over a variety of benchmarks.
  • Keywords
    magnetic tunnelling; random-access storage; CACTI-based memory modeling; STT RAM; SimpleScalar; high access speed; last-level on-chip cache; magnetic tunneling junction; random access memory; spin-torque transfer RAM; storage device; Cache memories; magnetic tunneling junction; spin-torque transfer;
  • fLanguage
    English
  • Journal_Title
    Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1063-8210
  • Type

    jour

  • DOI
    10.1109/TVLSI.2009.2035509
  • Filename
    5352236