DocumentCode
1353941
Title
Impact of Surface Orientation on the Sensitivity of FinFETs to Process Variations—An Assessment Based on the Analytical Solution of the Schrödinger Equation
Author
Wu, Yu-Sheng ; Su, Pin
Author_Institution
Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Volume
57
Issue
12
fYear
2010
Firstpage
3312
Lastpage
3317
Abstract
This paper investigates the impact of surface orientation on Vth sensitivity to process variations for Si and Ge fin-shaped field-effect transistors (FinFETs) using an analytical solution of the Schrödinger equation. Our theoretical model considers the parabolic potential well due to short-channel effects and, therefore, can be used to assess the quantum-confinement effect in short-channel FinFETs. Our study indicates that, for ultrascaled FinFETs, the importance of channel thickness (tch) variations increases due to the quantum-confinement effect. The Si-(100) and Ge-(111) surfaces show lower Vth sensitivity to the tch variation as compared with other orientations. On the contrary, the quantum-confinement effect reduces the Vth sensitivity to the Leff variation, and Si-(111) and Ge-(100) surfaces show lower Vth sensitivity as compared with other orientations. Our study may provide insights for device design and circuit optimization using advanced FinFET technologies.
Keywords
MOSFET; Schrodinger equation; germanium; silicon; FinFET sensitivity; Ge; Schrödinger equation; Si; channel thickness variations; fin-shaped field-effect transistors; parabolic potential well; quantum-confinement effect; short-channel effects; surface orientation; ultrascaled FinFET; Analytical models; FinFETs; Schrodinger equation; Sensitivity; Silicon; Fin-shaped field-effect transistor (FinFET); quantum effects; surface orientation; variation;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2010.2080682
Filename
5604680
Link To Document