DocumentCode
1354255
Title
Analytical approach for thermal and electrical design of multilayer structure integrated devices
Author
Pesare, M. ; Giorgio, A. ; Perri, A.G.
Author_Institution
Dipt. di Elettrotecnica ed Elettronica, Politecnico di Bari, Bari, Italy
Volume
36
Issue
13
fYear
2000
fDate
6/22/2000 12:00:00 AM
Firstpage
1120
Lastpage
1121
Abstract
An analytical method for the electrothermal design of multilayer structure integrated devices is presented. It can be easily applied to a large variety of devices and is independent of the specific physical properties of the layers, also accounting for the temperature dependence of the thermal conductivity
Keywords
Poisson equation; integrated circuit design; thermal conductivity; thermal resistance; Poisson equation; electrothermal design; multilayer structure integrated devices; physical properties; temperature dependence; thermal conductivity;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:20000805
Filename
850455
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