Title :
Reliability of an Electronic Assembly: A Case History
Author_Institution :
Dept. D73, Bldg 061; IBM Communication Products Division; Research Triangle Park, North Carolina 27709 USA.
Abstract :
This article describes the work done in evaluating the reliability of a printed-circuit-card assembly. Some assemblies went through thermal shock, humidity, and power-temperature cycling. A model was developed for interpreting a long term, high temperature life-test. Two iterations of the life test took place as part of the evaluation. A short term, intermediate temperature life-test of a relatively large number of assemblies preceded release to manufacturing.
Keywords :
Assembly; Circuit testing; Electronic equipment testing; History; Humidity; Life estimation; Life testing; Read only memory; Temperature; Thermal stresses; Accelerated life test; Case history; Electronic assembly;
Journal_Title :
Reliability, IEEE Transactions on
DOI :
10.1109/TR.1987.5222419
