DocumentCode :
1356415
Title :
Passive Equalizer Design for Through Silicon Vias With Perfect Compensation
Author :
Sun, Ruey-Bo ; Wen, Chang-Yi ; Wu, Ruey-Beei
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Volume :
1
Issue :
11
fYear :
2011
Firstpage :
1815
Lastpage :
1822
Abstract :
This paper proposes a novel passive equalizer which is composed of a parallel resistance-capacitance (RC) circuit and capable of perfect compensation for lossy effects of through silicon via (TSV). To design the equalizer, the conventional transmission line theory is utilized to derive an analytic circuit model of the TSV which is verified by numerical methods. Based on the analytic circuit model, the significance analysis is performed to acquire a much simplified capacitance-conductance circuit model which is employed to construct the design formula for the RC equalizer with perfect compensation. A ten-stacked TSV in series with the designed equalizer is taken as an example to demonstrate the resultant improvement in the eye diagram, namely, nearly zero timing jitter and three times enlarged eye opening.
Keywords :
RC circuits; capacitance; electric resistance; equalisers; integrated circuit modelling; three-dimensional integrated circuits; RC circuit; RC equalizer; analytic circuit model; capacitance-conductance circuit model; compensation; lossy effect; parallel resistance-capacitance circuit; passive equalizer; ten-stacked TSV; through silicon via; transmission line theory; zero timing jitter; Analytical models; Integrated circuit modeling; Numerical models; Substrates; Through-silicon vias; Equalizer; loss compensation; through silicon via; vertical interconnection;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2011.2164405
Filename :
6056558
Link To Document :
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