Title :
Mushroom-Type Ground Plane Structure for Wideband SSN Suppression in High-Speed Circuits
Author :
Li, Jianjie ; Mao, Junfa ; Tang, Min
Author_Institution :
Key Lab. of Minist. of Educ. of China for Res. of Design & Electromagn. Compatibility of High speed Electron. Syst., Shanghai Jiao Tong Univ., Shanghai, China
Abstract :
A novel design of ground plane with mushroom-type structures is proposed for wideband suppression of simultaneous switching noise (SSN) in high-speed printed circuit boards. The mushroom-type ground plane (MGP) structure consists of two square patches which are connected to the ground plane by specially designed traces and vias. It is more compact than the mushroom-type electromagnetic bandgap (MEBG) structure where the whole middle layer is occupied by periodic patches. Simulation and measurement results show that the SSN is suppressed significantly by the MGP. A -30 dB suppression bandwidth extending from 600 MHz to 7.5 GHz is achieved by a modified MGP structure.
Keywords :
broadband networks; high-speed integrated circuits; interference suppression; photonic band gap; printed circuits; MGP structure; high-speed circuit; high-speed printed circuit board; mushroom-type electromagnetic bandgap structure; mushroom-type ground plane structure; simultaneous switching noise; two square patch; wideband SSN suppression; Cutoff frequency; Inductance; Noise measurement; Periodic structures; Resonant frequency; Wideband; Localized suppression; mushroom-type ground plane (MGP); simultaneous switching noise (SSN);
Journal_Title :
Microwave and Wireless Components Letters, IEEE
DOI :
10.1109/LMWC.2011.2170829
