Title :
SAR and induced current distributions for operator exposure to RF dielectric sealers
Author :
Chen, Jin-Yuan ; Gandhi, Om P. ; Conover, David L.
Author_Institution :
Dept. of Electr. Eng., Utah Univ., Salt Lake City, UT, USA
fDate :
8/1/1991 12:00:00 AM
Abstract :
The finite-difference time-domain method is used to calculate local, layer-averaged, and whole-body averaged specific absorption rates (SARs) and induced current distributions in a 16-tissue, anatomically based, 5628-cell model of a human to assess operator exposure to RF sealers. Industrially relevant shapes and dimensions of commonly used RF dielectric heaters using parallel-plate and bar-type electrodes are considered. Realistic postures of the human operators are used for the calculations, including extending arms to simulate working conditions or an operator sitting on a wooden or metallic stool. Due to the high-intensity leakage fields in proximity to the RF applicators, some of the highest induced currents and SARs are calculated for the hands and the ankles and, in the sitting position, the knees. It is concluded that steps should therefore be taken either to reduce the leakage fields or shield the hands and the knees if it is necessary for them to be in high leakage field regions
Keywords :
biological effects of fields; current distribution; electromagnetic induction; health hazards; personnel; radiofrequency heating; RF applicators; RF dielectric heaters; RF dielectric sealers; ankles; arms; bar-type electrodes; finite-difference time-domain method; hands; health hazards; high-intensity leakage fields; induced current distributions; knees; layer averaged absorption rate; local absorption rate; operator exposure; parallel plate electrodes; sitting position; specific absorption rates; whole body averaged absorption rate; working conditions; Current distribution; Defense industry; Dielectrics; Finite difference methods; Humans; Knee; Radio frequency; Shape; Specific absorption rate; Time domain analysis;
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on