Solid state [Development forecast]

Author

Geppert, L.

Volume

34

Issue

1

fYear

1997

Firstpage

55

Lastpage

59

Abstract

No end is in sight for the transistor´s downsizing and hence for the growth in IC functionality-much of which is now being applied to features that enhance home and entertainment electronics. Architectural changes in microprocessors, for instance, admit multimedia, communications, and portable applications. The mounting technical challenges and expense of doubling the circuit density and performance of ICs every 18 months are multiplying the number of national and international consortia and alliances. Such efforts are diverse. Some of them center on developing the technologies needed to shrink the transistor´s dimensions below 0.1 μm, others on achieving a dynamic RAM (DRAM) cell size smaller than 0.25 μm². Yet others seek dominance in wireless technology or the establishment of industry standards.

Keywords

DRAM chips; integrated circuit technology; microprocessor chips; monolithic integrated circuits; multimedia systems; technological forecasting; DRAM; IC functionality; IC performance; circuit density; communications; development forecast; dynamic RAM; entertainment electronics; home electronics; international alliances; international consortia; microprocessor architecture; multimedia; national alliances; national consortia; portable applications; solid state; technical challenges; transistor downsizing; wireless technology; Electrons; FETs; Lithography; Manufacturing; Microprocessors; Random access memory; Silicon; Solid state circuits; Telephony; Temperature;

fLanguage

English

Journal_Title

Spectrum, IEEE

Publisher

ieee

ISSN

0018-9235

Type

jour

DOI

10.1109/6.560643

Filename

560643