DocumentCode
1358334
Title
Long-Endurance Nanocrystal
Resistive Memory Using a TaON Buffer Layer
Author
Cheng, C.H. ; Chen, P.C. ; Wu, Y.H. ; Yeh, F.S. ; Chin, Albert
Author_Institution
Dept. of Electron. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Volume
32
Issue
12
fYear
2011
Firstpage
1749
Lastpage
1751
Abstract
Using nanocrystal (nc) TiO2 and TaON buffer layer, the Ni/GeOx/nc-TiO2/TaON/TaN resistive random access memory (RRAM) showed forming-free resistive switching, self compliance set/reset currents, excellent current distribution, low 0.7-pJ switching energy, and long 1010 cycling endurance. The very long endurance in this novel RRAM may create new applications beyond Flash memory.
Keywords
germanium compounds; nickel; random-access storage; tantalum compounds; titanium compounds; Ni-GeO-TiO2-TaON-TaN; RRAM; flash memory; forming-free resistive switching; long-endurance nanocrystal resistive memory; nanocrystal buffer layer; resistive random access memory; self-compliance set-reset currents; Current measurement; Electrodes; Flash memory; Nickel; Resistance; Switches; Very large scale integration; $hbox{TiO}_{2}$ ; $hbox{GeO}_{2}$ ; hopping conduction; resistive random access memory (RRAM);
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2011.2168939
Filename
6058577
Link To Document