DocumentCode
1358541
Title
Evaluation and selection of LiNbO/sub 3/ and LiTaO/sub 3/ substrates for SAW devices by the LFB ultrasonic material characterization system
Author
Kushibiki, Jun-ichi ; Ohashi, Yuji ; Ono, Yuu
Author_Institution
Dept. of Electr. Eng., Tohoku Univ., Sendai, Japan
Volume
47
Issue
4
fYear
2000
fDate
7/1/2000 12:00:00 AM
Firstpage
1068
Lastpage
1076
Abstract
This paper demonstrates the evaluation and selection of commercially available LiNbO/sub 3/ and LiTaO/sub 3/ single crystals and wafers for surface acoustic wave (SAW) devices using the line-focus-beam ultrasonic material characterization (LFB-UMC) system. This system enables measuring leaky-SAW (LSAW) propagation characteristics precisely and efficiently for a number of specimens. The wafers are prepared from the top, middle, and bottom parts of four 128/spl deg/YX LiNbO/sub 3/ and seven X-112/spl deg/Y LiTaO/sub 3/ single crystals. For both series of crystals, the measured LSAW velocities increase from top to bottom in the crystals and with the increasing crystal growth number. The velocity changes for all wafers are 0.036% for 128/spl deg/YX LiNbO/sub 3/ and 0.035% for X-112/spl deg/Y LiTaO/sub 3/, corresponding to changes of 0.038 mol% and 0.075 mol% in Li/sub 2/O concentration, respectively. Moreover, the inhomogeneity in the first X-112/spl deg/Y LiTaO/sub 3/ single crystal caused by some undesirable wafer fabrication processes can be detected precisely, although it is difficult for the conventional methods to obtain such information.
Keywords
ferroelectric materials; lithium compounds; substrates; surface acoustic wave devices; ultrasonic propagation; ultrasonic velocity measurement; LFB ultrasonic material characterization system; LiNbO/sub 3/; LiNbO/sub 3/ substrates; LiTaO/sub 3/; LiTaO/sub 3/ substrates; SAW devices; crystal growth number; evaluation; inhomogeneity; leaky-SAW propagation characteristics; line-focus-beam ultrasonic material characterization; selection; single crystals; surface acoustic wave; velocity changes; wafer fabrication processes; wafers; Acoustic materials; Acoustic measurements; Acoustic propagation; Acoustic waves; Crystalline materials; Crystals; Surface acoustic wave devices; Surface acoustic waves; Ultrasonic variables measurement; Velocity measurement;
fLanguage
English
Journal_Title
Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
Publisher
ieee
ISSN
0885-3010
Type
jour
DOI
10.1109/58.852091
Filename
852091
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