Title :
Design and Analysis of A 5.3-pJ 64-kb Gated Ground SRAM With Multiword ECC
Author :
Jahinuzzaman, Shah M. ; Shah, Jaspal Singh ; Rennie, David J. ; Sachdev, Manoj
Author_Institution :
Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, QC, Canada
Abstract :
This paper presents an SRAM architecture employing a multiword-based ECC (MECC) scheme for soft error mitigation and a row virtual ground technique for array leakage reduction. The MECC combines four data words to form a 128 bit composite ECC word, two of which are interleaved in a row to mitigate cosmic neutron-induced multi-bit errors. The use of a composite word reduces the number of check-bits by 68%, however, requires a unique write operation that updates the check-bits by writing one data word while reading the other three data words. The ground potential of the composite word is raised to a nonzero value during retention in order to limit the leakage power consumption. A critical charge-based soft error rate (SER) model is proposed to estimate the resulting increase in the SER. Both the MECC scheme and the SER model are verified by implementing a 64-kb SRAM macro in 90 nm CMOS technology. The SRAM consumes 5.34 pJ energy with a data latency of 3.3 ns, thus showing up to 82% per-bit energy saving and 8x speed improvement over previously reported multiword ECC schemes. Accelerated neutron radiation test of the SRAM confirms 85% soft error correction by the MECC and 90% accuracy of the SER model.
Keywords :
CMOS logic circuits; SRAM chips; error correction codes; CMOS technology; SRAM architecture; charge-based soft error rate model; energy 5.3 pJ; error control code; memory size 64 KByte; multiword-based ECC; size 90 nm; soft error mitigation; virtual ground technique; word length 128 bit; CMOS technology; Delay; Energy consumption; Error analysis; Error correction codes; Life estimation; Neutrons; Random access memory; Semiconductor device modeling; Writing; Error correction; SRAM chips; leakage current; multiword; soft error;
Journal_Title :
Solid-State Circuits, IEEE Journal of
DOI :
10.1109/JSSC.2009.2021088