DocumentCode :
1359792
Title :
A 40 nm 222 mW H.264 Full-HD Decoding, 25 Power Domains, 14-Core Application Processor With x512b Stacked DRAM
Author :
Kikuchi, Yu ; Takahashi, Makoto ; Maeda, Tomohisa ; Fukuda, Masatoshi ; Koshio, Yasuhiro ; Hara, Hiroyuki ; Arakida, Hideho ; Yamamoto, Hideaki ; Hagiwara, Yousuke ; Fujita, Tetsuya ; Watanabe, Manabu ; Ezawa, Hirokazu ; Shimazawa, Takayoshi ; Ohara, Yasu
Author_Institution :
Toshiba Corp., Kawasaki, Japan
Volume :
46
Issue :
1
fYear :
2011
Firstpage :
32
Lastpage :
41
Abstract :
In this paper we introduce a 14-core application processor for multimedia mobile applications, implemented in 40 nm, with a 222 mW H.264 full high-definition (full-HD) video engine, a 124 mW 40 M-polygons/s 3D/2D graphics engine, and a video/audio multiprocessor for various Codecs and image processing. The application processor has 25 power domains to achieve coarse-grain power gating for adjusting to the required performance of wide range of multimedia applications. The simple on-chip power switch circuits perform less than 1 μs switching while reducing rush current. Furthermore, the Stacked Chip SoC (SCS) technology enables rewiring to the DRAM chip during assembly/packaging phase using a wire with 10 μm minimum pitch on Re-Distribution Layer (RDL) using electroplating. The peak memory bandwidth is 10.6 GB/s with an x512b SCS-DRAM interface, and the power consumption of this interface is 3.9 mW at 2.4 GB/s workload.
Keywords :
DRAM chips; codecs; multimedia systems; multiprocessing systems; system-on-chip; video coding; 3D/2D graphics engine; H.264; codecs; full-HD decoding; image processing; multimedia mobile applications; power 222 mW; power 3.9 mW; size 40 nm; stacked DRAM; stacked chip SoC; video engine; video/audio multiprocessor; Codecs; Engines; Memory management; Multimedia communication; Power demand; Wire; Wiring; Application processor; MICRO bump; Re-Distribution Layer (RDL); full high-definition (full-HD) video; multiple power domains; on-chip LV-PMOS switch; stacked DRAM;
fLanguage :
English
Journal_Title :
Solid-State Circuits, IEEE Journal of
Publisher :
ieee
ISSN :
0018-9200
Type :
jour
DOI :
10.1109/JSSC.2010.2079370
Filename :
5608523
Link To Document :
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