• DocumentCode
    1360282
  • Title

    Signal integrity analysis of interconnects using the FDTD method and a layer peeling technique

  • Author

    Schuster, Christian ; Fichtner, Wolfgang

  • Author_Institution
    Dept. of Electr. Eng., Swiss Fed. Inst. of Technol., Zurich, Switzerland
  • Volume
    42
  • Issue
    2
  • fYear
    2000
  • fDate
    5/1/2000 12:00:00 AM
  • Firstpage
    229
  • Lastpage
    233
  • Abstract
    This paper presents the application of an impedance layer peeling technique to network parameter extraction from finite-difference time-domain (FDTD) simulations. It is shown that the combination of both methods offers a simple and efficient way to analyze lossless linear 1- or 2-port structures. The extraction of equivalent entirely in the time domain and the optimization of lumped element parameters is not necessary. Special attention is paid to the problem of injecting voltage steps with short risetimes into the FDTD grid. Results obtained with this technique are compared to network analyzer measurements and usual FDTD analysis based on scattering parameter extraction
  • Keywords
    S-parameters; digital simulation; electric impedance; equivalent circuits; finite difference time-domain analysis; interconnections; network analysers; optimisation; time-domain analysis; transmission line theory; FDTD grid; FDTD method; FDTD simulations; finite-difference time-domain; impedance layer peeling; interconnects; lossless linear 1-port structure; lossless linear 2-port structure; lumped element parameters optimization; network analyzer measurements; network parameter extraction; scattering parameter extraction; short risetimes; signal integrity analysis; time domain; uniform transmission line; voltage steps; Electromagnetic waveguides; Finite difference methods; Impedance; Integrated circuit interconnections; Reflection; Scattering parameters; Signal analysis; Time domain analysis; Transmission line measurements; Voltage;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/15.852417
  • Filename
    852417