Title :
Signal integrity analysis of interconnects using the FDTD method and a layer peeling technique
Author :
Schuster, Christian ; Fichtner, Wolfgang
Author_Institution :
Dept. of Electr. Eng., Swiss Fed. Inst. of Technol., Zurich, Switzerland
fDate :
5/1/2000 12:00:00 AM
Abstract :
This paper presents the application of an impedance layer peeling technique to network parameter extraction from finite-difference time-domain (FDTD) simulations. It is shown that the combination of both methods offers a simple and efficient way to analyze lossless linear 1- or 2-port structures. The extraction of equivalent entirely in the time domain and the optimization of lumped element parameters is not necessary. Special attention is paid to the problem of injecting voltage steps with short risetimes into the FDTD grid. Results obtained with this technique are compared to network analyzer measurements and usual FDTD analysis based on scattering parameter extraction
Keywords :
S-parameters; digital simulation; electric impedance; equivalent circuits; finite difference time-domain analysis; interconnections; network analysers; optimisation; time-domain analysis; transmission line theory; FDTD grid; FDTD method; FDTD simulations; finite-difference time-domain; impedance layer peeling; interconnects; lossless linear 1-port structure; lossless linear 2-port structure; lumped element parameters optimization; network analyzer measurements; network parameter extraction; scattering parameter extraction; short risetimes; signal integrity analysis; time domain; uniform transmission line; voltage steps; Electromagnetic waveguides; Finite difference methods; Impedance; Integrated circuit interconnections; Reflection; Scattering parameters; Signal analysis; Time domain analysis; Transmission line measurements; Voltage;
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
