DocumentCode
1360912
Title
Verification and Codesign of the Package and Die Power Delivery System Using Wavelets
Author
Ferzli, Imad A. ; Chiprout, Eli ; Najm, Farid N.
Volume
29
Issue
1
fYear
2010
Firstpage
92
Lastpage
102
Abstract
Keywords
Computational modeling; Design automation; Electromagnetic modeling; Fluctuations; Frequency; Packaging; Power grids; Power supplies; RLC circuits; Voltage; Integrated circuit packaging; power grid; verification; voltage drop; wavelet transform;
fLanguage
English
Journal_Title
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher
ieee
ISSN
0278-0070
Type
jour
DOI
10.1109/TCAD.2009.2034563
Filename
5356294
Link To Document