• DocumentCode
    1360912
  • Title

    Verification and Codesign of the Package and Die Power Delivery System Using Wavelets

  • Author

    Ferzli, Imad A. ; Chiprout, Eli ; Najm, Farid N.

  • Volume
    29
  • Issue
    1
  • fYear
    2010
  • Firstpage
    92
  • Lastpage
    102
  • Abstract
    As part of the design of large integrated circuits, one must verify that the power delivery network provides supply and ground voltages to the circuit that are within specified ranges. We introduce the concept of time-frequency description of circuit currents using wavelets, and use that to set up an optimization framework that finds the worst-case supply/ground voltage fluctuations. This framework allows for the quick determination of the impact of either the package or the die on the worst-case behavior, which enables their codesign. This approach has been applied to an industrial microprocessor design, resulting in realistic and nonobvious worst-case waveforms.
  • Keywords
    Computational modeling; Design automation; Electromagnetic modeling; Fluctuations; Frequency; Packaging; Power grids; Power supplies; RLC circuits; Voltage; Integrated circuit packaging; power grid; verification; voltage drop; wavelet transform;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/TCAD.2009.2034563
  • Filename
    5356294