DocumentCode :
136112
Title :
Comparison of spot and wide beam implanters for making SOI wafers by layer transfer
Author :
Jost, Z. ; Jones, Andrew ; Lottes, C. ; Peidous, I. ; Ries, M. ; Usenko, A.
Author_Institution :
SunEdison Semicond., St. Peters, MO, USA
fYear :
2014
fDate :
June 26 2014-July 4 2014
Firstpage :
1
Lastpage :
3
Abstract :
The quality of silicon-on-insulator (SOI) wafers manufactured with either spot beam implanter or wide beam implanter are compared. The comparison shows similar quality wafers and a potential advantage of wide beam implanters in throughput.
Keywords :
ion implantation; silicon-on-insulator; SOI wafers; layer transfer; silicon-on-insulator wafers; spot beam implanter; wide beam implanters; Helium; Hydrogen; Implants; Silicon; Strain; Substrates; Temperature measurement; SOI; helium implantation; hydrogen ion implantation; layer transfer; spot beam; wide beam;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ion Implantation Technology (IIT), 2014 20th International Conference on
Conference_Location :
Portland, OR
Type :
conf
DOI :
10.1109/IIT.2014.6939973
Filename :
6939973
Link To Document :
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