DocumentCode
136147
Title
Simulation of 3D FinFET doping profiles introduced by ion implantation and the impact on device performance
Author
Liping Wang ; Brown, Andrew ; Cheng, Binjie ; Asenov, Asen
Author_Institution
Sch. of Eng., Univ. of Glasgow, Glasgow, UK
fYear
2014
fDate
June 26 2014-July 4 2014
Firstpage
1
Lastpage
4
Abstract
A simulation program, Anadope3D, developed to model ion implantations in FinFETs based on quasi-analytic methods, has been improved to include a set of analytical implantation models based on a Pearson distribution function, which is concise and computationally efficient. This C++ module has been integrated into the GSS atomistic device simulator GARAND, which enables more realistic doping distributions arising from ion implantation to be used for TCAD FinFET simulations. Simulations are performed on an example of an SOI FinFET with physical gate length of 20nm, including statistical simulations with Random Discrete Dopants (RDD). The impact of the realistic 3D doping profile on FinFET performance has been investigated.
Keywords
MOSFET; ion implantation; semiconductor device models; semiconductor doping; silicon-on-insulator; statistical analysis; technology CAD (electronics); 3D FinFET doping; Anadope3D; C++ module; GARAND; GSS atomistic device simulator; Pearson distribution function; SOI; TCAD FinFET simulations; analytical implantation models; ion implantations; quasi-analytic methods; random discrete dopants; simulation program; size 20 nm; statistical simulations; Doping profiles; FinFETs; Ion implantation; Performance evaluation; Semiconductor process modeling; Three-dimensional displays; Doping; FinFETs; Ion implantation; Statistical variability;
fLanguage
English
Publisher
ieee
Conference_Titel
Ion Implantation Technology (IIT), 2014 20th International Conference on
Conference_Location
Portland, OR
Type
conf
DOI
10.1109/IIT.2014.6940008
Filename
6940008
Link To Document