Title :
The effects of scaling on Back End of Line Processing
Author :
Verdonck, Patrick ; Wilson, Christopher J. ; Liang Gong Wen
Author_Institution :
imec, Leuven, Belgium
Abstract :
Back End of Line Processing has an ever increasing impact on the whole of integrated circuit manufacturing. Its influence on the delay of the signals is already for some nodes higher than the Front End of Line Processes. Besides, for the more advanced nodes, the back end cost will be as high or higher than the front end cost. The technological challenges are ever more difficult to meet, the red brick wall looms for different unit processes. In this paper, we´ll review some of the most interesting issues that scaling is causing to Back End Of Line processing.
Keywords :
integrated circuit interconnections; integrated circuit manufacture; integrated circuit metallisation; low-k dielectric thin films; photolithography; advanced nodes; back end cost; back end of line processing; front end cost; front end of line processes; integrated circuit manufacturing; interconnect metal level; lithography; low-k films; metallization; red brick wall; signal delay; Air gaps; Dielectrics; Etching; Films; Metallization; Reliability; BEOL; damascene; dielectric films; etching; lithography; metallization;
Conference_Titel :
Microelectronics Technology and Devices (SBMicro), 2014 29th Symposium on
Conference_Location :
Aracaju
DOI :
10.1109/SBMicro.2014.6940080
