DocumentCode :
1362117
Title :
Metal-oxide semiconductor field-effect transistors using Schottky barrier drains
Author :
Huang, Feng-Jung ; O, K.K.
Author_Institution :
Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA
Volume :
33
Issue :
15
fYear :
1997
fDate :
7/17/1997 12:00:00 AM
Firstpage :
1341
Lastpage :
1342
Abstract :
1.2 μm p-channel MOSFETs with a TiSi2-Si barrier drain and a p+ implanted source have been fabricated. Parasitic drain-to-n-well-to-p+-source bipolar transistor measurements showed no current gain since the Schottky-barrier-drain (SBDR) does not inject minority carriers (holes) to the n-well base. The SBDR could be useful for preventing latch-up in integrated CMOS RF amplifiers
Keywords :
MOSFET; Schottky barriers; 1.2 micron; Schottky barrier drain; TiSi2-Si; current gain; integrated CMOS RF amplifier; latch-up; metal-oxide semiconductor field-effect transistor; minority carrier injection; p-channel MOSFET; p+ implanted source; parasitic drain-to-n-well-to-p+-source bipolar transistor;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el:19970904
Filename :
606094
Link To Document :
بازگشت