Title :
Integration of Grid Array Antenna in Chip Package for Highly Integrated 60-GHz Radios
Author :
Sun, Mei ; Zhang, Y.P. ; Guo, Y.X. ; Chua, K.M. ; Wai, L.L.
Author_Institution :
Inst. for Infocomm Res., Singapore, Singapore
fDate :
7/1/1905 12:00:00 AM
Abstract :
A grid array antenna integrated in a thin cavity-down ceramic ball grid array (CBGA) package in low-temperature cofired ceramic (LTCC) technology is reported. The grid array antenna, intended for use in highly integrated 60-GHz radios, has achieved good matching (|S11| ?? -10 dB) and directional patterns from 57 to 64 GHz as well as high gain with the peak value of 13.5 dBi at 60 GHz.
Keywords :
antenna arrays; ball grid arrays; ceramic packaging; chip package; frequency 57 GHz to 64 GHz; frequency 60 GHz; grid array antenna; integrated radios; low-temperature cofired ceramic technology; thin cavity-down ceramic ball grid array package; 60-GHz radio; grid array antenna; grid array package; low-temperature cofired ceramic (LTCC);
Journal_Title :
Antennas and Wireless Propagation Letters, IEEE
DOI :
10.1109/LAWP.2009.2039031
