• DocumentCode
    1363959
  • Title

    Linear Scaling of Reset Current Down to 22-nm Node for a Novel \\hbox {Cu}_{x}\\hbox {Si}_{y}\\hbox {O} RRAM

  • Author

    Yang, L.M. ; Song, Y.L. ; Liu, Y. ; Wang, Y.L. ; Tian, X.P. ; Wang, M. ; Lin, Y.Y. ; Huang, R. ; Zou, Q.T. ; Wu, J.G.

  • Author_Institution
    State Key Lab. of ASIC & Syst., Fudan Univ., Shanghai, China
  • Volume
    33
  • Issue
    1
  • fYear
    2012
  • Firstpage
    89
  • Lastpage
    91
  • Abstract
    The relationship between low resistance (Ron) and cell size (from 40 nm to 100 μm) is systematically investigated using a 1-Mb CuxSiyO resistive RAM (RRAM) array. To our knowledge, this is the first study to attempt such an endeavor. Spacer pattern technology is employed to obtain a small cell size on the basis of a 0.13-μm standard logic process. Ron exhibits minimal change at 100 μm to 90 nm of RRAM size. However, it quadratically increases at 90 to 40 nm. The reset current, which is highly dependent on Ron, is linearly reduced fivefold in accordance with cell size, thereby improving overall power reduction and cell size scaling. The Ron dependence on cell size can be well explained by the dendritelike conductive filament model.
  • Keywords
    copper compounds; random-access storage; CuxSiyO; RRAM; dendritelike conductive filament model; linear scaling; reset current; resistive RAM array; size 40 nm to 100 mum; spacer pattern technology; Arrays; Electrical resistance measurement; Random access memory; Resistance; Shape; Switches; System-on-a-chip; Conductive filament (CF); low resistance state; resistive RAM (RRAM); scaling down;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2011.2170654
  • Filename
    6062643