DocumentCode
1364072
Title
Small signal analysis of source vapor control requirements for APCVD
Author
Mayer, Bruce
Author_Institution
Semicond. Equipment Group, Watkins-Johnson Co., Scotts Valley, CA, USA
Volume
9
Issue
3
fYear
1996
fDate
8/1/1996 12:00:00 AM
Firstpage
344
Lastpage
365
Abstract
A method for small signal operating point analysis of the stability of chemical source vapor flow from liquid source vapor generators (bubblers) is presented. The analytical technique allow´s quantification of the relative effect of changes in the flow, pressure, and temperature operating conditions of the vapor generator on the vapor output of the generator. Application of the analysis to ({tetraethylorthosilicate≡TEOS)+{trimethylphosphite ≡TMPi}+({trimethyl borate≡TMB}+{O3≡ozone) based atmospheric pressure chemical vapor deposition (APCVD) processes yields example stability criteria for the bubbler control parameters. Examination of 5-wt%-B/4-wt%-P BPSG pre-metal dielectric (PMD), and SiO 2 intermetal dielectric (IMD) processes show that variances in the bubbler temperature, ΔT, bubbler head space pressure, ΔPHS, and carrier nitrogen flow, ΔQN2 affect the source vapor flow variance, ΔQν, in the ratio of about 4.3:2.8:1 respectively. Film-doping and film-depth range-method uniformity specifications of ±0.1 wt% and ±2% require bubbler parameter control limits of: ΔT<0.25°C, ΔPHS⩽6 torr, and ΔQN2⩽0.3% of operating point flow
Keywords
borosilicate glasses; chemical vapour deposition; dielectric thin films; phosphosilicate glasses; semiconductor process modelling; silicon compounds; APCVD; B2O3-P2O5-SiO2; BPSG; BPSG pre-metal dielectric; SiO2; SiO2 intermetal dielectric; TEOS-TMPi-TMB-ozone; atmospheric pressure chemical vapor deposition; bubbler control; chemical source vapor flow; film depth range; film doping; liquid source vapor generator; operating point; small signal analysis; stability; Chemical analysis; Chemical vapor deposition; Dielectrics; Fluid flow; Pressure control; Signal analysis; Signal generators; Stability analysis; Stability criteria; Temperature;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/66.536108
Filename
536108
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