DocumentCode :
1364124
Title :
Bipolar integrated Kelvin test structure for contact resistance measurement of self-aligned implantations
Author :
Nanver, Lis K. ; Goudena, Egbert J G ; Slabbekoorn, John
Author_Institution :
Inst. for Microelectron. & Submicron Technol., Delft Univ. of Technol., Netherlands
Volume :
9
Issue :
3
fYear :
1996
fDate :
8/1/1996 12:00:00 AM
Firstpage :
455
Lastpage :
460
Abstract :
A Kelvin contact resistance test structure has been developed for accurate measurement of highly-doped, shallow n+ and p+ implantations, which are self-aligned to the contact window. Here the structure has been integrated, without additional processing, in a 30 GHz washed-emitter-base n-p-n bipolar process, for the purpose of monitoring the emitter contact resistance. Diffusion taps to the emitter have been made with the phosphorus collector-plug implantation. Phosphorus evaporation from the contact window during the anneal step and the low sheet resistance of the collector-plug implantation, together with the overall design of the test structure, assure a very accurate determination of the emitter contact resistance even in situations where complete junction isolation of the diffusion taps is not directly possible. Results are presented for the optimization of the emitter anneal cycle with respect to the emitter contact resistance
Keywords :
annealing; bipolar transistors; contact resistance; electric resistance measurement; ion implantation; semiconductor device testing; 30 GHz; annealing; collector-plug implantation; diffusion tap; emitter contact resistance measurement; highly-doped shallow implantation; integrated Kelvin test structure; phosphorus evaporation; self-aligned implantation; sheet resistance; washed-emitter-base n-p-n bipolar transistor; Annealing; Automatic testing; Conductivity; Contact resistance; Electrical resistance measurement; Kelvin; Particle measurements; Resistors; Transmission line measurements; Velocity measurement;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/66.536116
Filename :
536116
Link To Document :
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