DocumentCode :
1364797
Title :
Analysis, Optimization, and Design of 2–2.8 \\mu \\hbox {m} Stacked Multiple-Junction PIN GaInAsSb/GaSb Photodetectors for Future O/E Interconnections
Author :
Liang, Bangli ; Chen, Dianyong ; Wang, Bo ; Kwasniewski, Tadeusz A. ; Wang, Zhigong
Author_Institution :
Carleton Univ., Ottawa, ON, Canada
Volume :
57
Issue :
2
fYear :
2010
Firstpage :
361
Lastpage :
367
Abstract :
The 2-2.8 μm vertically stacked multiple-junction PIN GalnAsSb/GaSb photodetectors are analyzed, optimized, and designed based on an improved general mode to predict the optimal performance of PIN infrared photodetectors arising from nonequilibrium carrier generation, diffusion, and recombination theory. Optimal thickness of intrinsic absorption region (Wopt), response quantum efficiency (RQE), detectivity (D*), and -3-dB cutoff frequency (f_3dB) are calculated and optimized for a 2-2.8 μm room-temperature high-frequency operation. Ways to achieve optimal performance in practice, material, and device structures are proposed. The optimized vertically stacked multiple-junction PIN GalnAsSb/GaSb photodetector structure shows a D* of (1.6-1.9) × 1012 cm· Hz1/2/W,an RQE of 52%-69%, and a f- 3 dB ≫ 20 GHz with Wopt = 3 μm and junction number K = 5, effective illumination area Ad = 1000 μm2, and reverse bias voltage VRB = 0.5 V. The proposed general model is validated by simulation and measurement data of fabricated single-junction detectors.
Keywords :
III-V semiconductors; arsenic compounds; gallium compounds; indium compounds; p-i-n photodiodes; photodetectors; GaInAsSb-GaSb; O/E interconnections; intrinsic absorption region; multiple-junction PIN photodetectors; nonequilibrium carrier generation; recombination theory; response quantum efficiency; size 2 μm to 2.8 μm; size 3 μm; voltage 0.5 V; Area measurement; Cutoff frequency; Design optimization; Electromagnetic wave absorption; Lighting; Optimized production technology; Performance analysis; Photodetectors; Radiative recombination; Voltage; GaInAsSb/GaSb; PIN; multiple junction; optical–electrical (O/E) interconnections; photodetectors; vertically stacked;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2009.2036303
Filename :
5361371
Link To Document :
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