Title :
The trials of wafer-scale integration: Although major technical problems have been overcome since WSI was first tried in the 1960s, commercial companies can´t yet make it fly
Author :
McDonald, John ; Rogers, E.H. ; Rose, Kenneth ; Steckl, A.J.
Author_Institution :
Rensselaer Polytech. Inst., Troy, NY, USA
Abstract :
The advantages and problems of wafer-scale integration (WSI) are described. The advantages of semiconductor integrated circuits are high reliability, minimized interconnections, and decreased signal delay. The problems concern heat removal, signal quality, and the need for discretionary wiring. Finally, some recent approaches to WSI fabrication are discussed.
Keywords :
integrated circuit technology; monolithic integrated circuits; WSI fabrication; discretionary wiring; heat removal; integrated circuit technology; interconnections; reliability; semiconductor integrated circuits; semiconductor technology; signal delay; signal quality; wafer-scale integration; Delay; Heating; Integrated circuit interconnections; Logic gates; Metals; Pins; Wiring;
Journal_Title :
Spectrum, IEEE
DOI :
10.1109/MSPEC.1984.6370295
