Experimental Approach and Evaluation on Dynamic Reliability of PBGA Assembly

Author

Yang, Ping ; Chen, Zixia

Author_Institution

Lab. of Adv. Design, Jiangsu Univ., Zhenjiang, China

Volume

56

Issue

10

fYear

2009

Firstpage

2243

Lastpage

2249

Abstract

The aim of this paper is to provide a systematic method to perform experimental test and theoretical evaluation on fatigue characteristics of plastic-ball-grid-array (PBGA) assembly under random vibration. A specified PBGA assembly which contains different structural and material parameters was manufactured. The fatigue characteristics of PBGA assembly under random vibration were tested. Manson-Coffin empirically derived formula and rain-flow algorithm were used to achieve the fatigue life of solder joints. In the meantime, the failure curve (reliability-cycle number curve) can be obtained by using Weibull distribution method when PBGA assembly is on different working situation. Finally, life prediction of corner solder balls was deduced based on three-band technology and cumulative damage index. Test results lay a basis for high-reliability design of PBGA assembly for engineering application.

Keywords

ball grid arrays; failure analysis; fatigue; plastic packaging; reliability; soldering; vibrations; Manson-Coffin empirical formula; PBGA assembly; Weibull distribution method; corner solder ball; cumulative damage index; dynamic reliability; failure curve; fatigue characteristic; fatigue life; plastic ball grid array assembly; rain-flow algorithm; random vibration; reliability-cycle number curve; solder joints; Assembly systems; Fatigue; Laboratories; Manufacturing; Microelectronics; Packaging; Soldering; Stress; Testing; Vibrations; Cumulative damage index (CDI); fatigue life characteristics; plastic-ball-grid-array (PBGA) assembly; random vibration; reliability;

fLanguage

English

Journal_Title

Electron Devices, IEEE Transactions on

Publisher

ieee

ISSN

0018-9383

Type

jour

DOI

10.1109/TED.2009.2027974

Filename

5233757