• DocumentCode
    1365080
  • Title

    Tin Whisker Test Development—Temperature and Humidity Effects Part I: Experimental Design, Observations, and Data Collection

  • Author

    Reynolds, Heidi L. ; Osenbach, John W. ; Henshall, Gregory ; Parker, Richard D. ; Su, Peng

  • Author_Institution
    Sun Microsyst., Inc., Santa Clara, CA, USA
  • Volume
    33
  • Issue
    1
  • fYear
    2010
  • Firstpage
    1
  • Lastpage
    15
  • Abstract
    The effects of temperature and humidity on tin whisker growth were investigated through a collaborative project sponsored by the International Electronics Manufacturing Initiative (iNEMI) and its member companies. A broad range of testing conditions was adopted to test a variety of components with matte tin (Sn) plating and copper (Cu)-based leadframes. The primary goal of the study was to collect data that could be used to develop mathematical models (acceleration functions) that describe the dependence of tin whisker growth and corrosion on temperature and humidity. This paper describes the background, experimental design, data collection and reports results. Part II of the study (J. W. Osenbach et a. ?Tin whisker test development-Temperature and humidity effects part II: Acceleration model development,? Electronics Packaging Manufacturing, Vol. 33, no. 1, pp., Jan. 2010) discusses in the data analyses and acceleration model development. Storage testing was performed over a wide range of temperature and humidity conditions from 30?C to 100?C and from 10% to 90% relative humidity (RH). Commercially produced components with both 3 ?m and 10 ?m thicknesses from three sources were evaluated. For components with the 10 ?m-plating, the plating was evaluated in both the as-plated and reflowed (260?C) conditions. These variations resulted in a large experimental matrix that included 13 different Sn platings, aged at ten different temperature and humidity combinations. Further, the aging test was done at five different laboratories with inspections performed at eight different laboratories. The data collected include 1) corrosion incubation time, 2) tin whisker incubation time, and 3) dependence of the maximum whisker length on storage time at each temperature/humidity condition. Data suggest that corrosion is not a unique driving force for whisker initiation and growth. Whisker formation differs in corroded and non-corroded regions. Due to the scope of this work, it is br- - oken down into two papers. The data and experimental observations are discussed in this paper. The mathematical model development, discussion of results and conclusions are included in Part II of this study.
  • Keywords
    ageing; copper alloys; corrosion; integrated circuit packaging; integrated circuit testing; materials testing; surface finishing; thermal management (packaging); tin; whiskers (crystal); CuJkJk; International Electronics Manufacturing Initiative company; Sn; acceleration functions; aging test; copper-based leadframes; corrosion; corrosion incubation time; humidity effects; matte tin plating; reflowed conditions; relative humidity; size 10 mum; size 3 mum; storage testing; storage time; surface finish; temperature 30 degC to 100 degC; temperature effects; testing conditions; tin whisker incubation time; tin whisker test development; whisker growth; whisker length; Acceleration; Pb-free; humidity storage; surface finish; temperature storage; testing; tin plating; tin whisker;
  • fLanguage
    English
  • Journal_Title
    Electronics Packaging Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-334X
  • Type

    jour

  • DOI
    10.1109/TEPM.2009.2030179
  • Filename
    5361410