Design and Tolerance Analysis of Out-of-Plane Coupling Components for Printed-Circuit-Board-Level Optical Interconnections

Author

Van Erps, Jürgen ; Debaes, Christof ; Thienpont, Hugo

Author_Institution

Dept. of Appl. Phys. & Photonics, Vrije Univ. Brussel, Brussels, Belgium

Volume

16

Issue

5

fYear

2010

Firstpage

1347

Lastpage

1354

Abstract

We present the design of discrete out-of-plane coupling components featuring a micromirror for 90° beam deflection in multimode optical interconnections at the printed circuit board level. We investigate the Goos-Hanchen shift that occurs upon total internal reflection at a 45° micromirror and assess the influence of applying a metal reflection coating on the micromirror as well as the tolerance for mechanical misalignments using nonsequential ray tracing simulations. Finally, we compare the simulated performance with experimental measurements on out-of-plane coupling components prototyped with deep proton writing.

Keywords

micromirrors; optical couplers; optical deflectors; optical interconnections; printed circuits; ray tracing; Goos-Hanchen shift; beam deflection; deep proton writing; discrete out-of-plane coupling component; mechanical misalignment; metal reflection coating; micromirror; multimode optical interconnection; nonsequential ray tracing simulation; printed circuit board level; tolerance analysis; Coatings; Coupling circuits; Micromirrors; Optical coupling; Optical design; Optical interconnections; Optical reflection; Printed circuits; Ray tracing; Tolerance analysis; Coupling components; deep proton writing (DPW); micromirrors; nonsequential ray tracing; optical interconnections; optical simulations; polymer; total internal reflection (TIR);

fLanguage

English

Journal_Title

Selected Topics in Quantum Electronics, IEEE Journal of

Publisher

ieee

ISSN

1077-260X

Type

jour

DOI

10.1109/JSTQE.2009.2037158

Filename

5361416