DocumentCode :
1365133
Title :
Modeling and Analysis of Parasitic Resistance in Double-Gate FinFETs
Author :
Tekleab, Daniel ; Samavedam, S. ; Zeitzoff, P.
Author_Institution :
IBM Semicond. R&D Center, Hopewell Junction, VA, USA
Volume :
56
Issue :
10
fYear :
2009
Firstpage :
2291
Lastpage :
2296
Abstract :
A comprehensive model is presented to analyze the three-dimensional (3-D) source-drain (S/D) resistance of undoped double-gated FinFETs of wide and narrow S/D width. The model incorporates the contribution of spreading, sheet, and contact resistances. The spreading resistance is modeled using a standard two-dimensional (2-D) model generalized to 3-D. The contact resistance is modeled by generalizing the one-dimensional (1-D) transmission line model to 2-D and 3-D with appropriate boundary conditions. The model is compared with the S/D resistance determined from 3-D device simulations and experimental data. We show excellent agreement between our model, the simulations, and experimental data.
Keywords :
MOSFET; contact resistance; semiconductor device models; 3D device simulation; 3D source-drain resistance; contact resistance; double ate FinFET; parasitic resistance; Boundary conditions; Contact resistance; Doping; FinFETs; MOSFETs; Metalworking machines; Power transmission lines; Semiconductor process modeling; Transmission lines; Two dimensional displays; Contact resistance; FinFET; SOI; double gate; series resistance; transmission-line model (TLM);
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2009.2028377
Filename :
5233786
Link To Document :
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