• DocumentCode
    1365490
  • Title

    Direct Measurements of Self-Sputtering, Swelling, and Deposition Effects of N-Type Low-Energy Ion Implantations

  • Author

    Qin, Shu ; Zhuang, Kent ; Hu, Yongjun Jeff ; McTeer, Allen ; Lu, Shifeng

  • Author_Institution
    Micron Technol. Inc., Boise, ID, USA
  • Volume
    37
  • Issue
    10
  • fYear
    2009
  • Firstpage
    2082
  • Lastpage
    2089
  • Abstract
    Angle-resolved X-ray photoelectron spectroscopy method was used to study self-sputtering effects of different n-type low-energy doping techniques, including conventional monoatomic 75As and 31P beam-line ion implants and AsH3 plasma doping (PLAD). It has been found that the self-sputtering effects of the beam-line implants correlate with the mass of ion species. As beam-line implant shows more serious self-sputtering effect than monoatomic P and B beam-line implants. Very low energy P implants show surface-swelling phenomena. PLAD process using AsH3 gas species has no sputtering effects but has slight deposition under current process condition.
  • Keywords
    X-ray photoelectron spectra; arsenic; elemental semiconductors; ion implantation; phosphorus; plasma materials processing; semiconductor doping; silicon; sputtering; swelling; Si:As; Si:P; angle-resolved X-ray photoelectron spectroscopy; deposition effects; monoatomic beam-line ion implants; n-type low-energy doping; n-type low-energy ion implantations; plasma doping; self-sputtering effects; surface-swelling phenomena; Angle-Resolved X-ray Photoelectron Spectroscopy (ARXPS); deposition; plasma doping (PLAD); self-sputtering; surface swelling;
  • fLanguage
    English
  • Journal_Title
    Plasma Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-3813
  • Type

    jour

  • DOI
    10.1109/TPS.2009.2029111
  • Filename
    5233842